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This is the DIONISYS top of the page header

The mission includes development of standardized payload subsystems and manuals that facilitate increasingly complex future payloads and the maximum transfer of corporate knowledge to future student participants. Additionally, the mission will provide opportunities for students to design, implement, and test innovative systems through hands-on experience and collaboration between disciplines, universities and practicing aerospace engineers and scientists.

Project DIONISYS: Electrical Components

Image for Deck Plate 5

Flight Computer
S-band TX
Patch Antennas
Power Splitter
EED Board

Image for Deck Plate 4

GPS
Accelerometer
Flight Instrumentation Board
Sun Attitude Sensor
Image for Deck Plate 3
Power Board
Battery Pack
Image for Deck Plate 2
Magnetometer
Image for Deck Plate 1
Radio Receivers
Ion and Electron Probe

Ion and Electron Probe

 

A picture of the Electron ProbeProbe Subsystem


The electron probe is biased at +5 V and designed to measure minute current fluctuations due to the electron density. Likewise, the ion probe is biased at –5 V and designed to measure minute fluctuations in ion density. They are thin platinum sheets that will be epoxied to the nose cone surface. Figure 3.3.5.1 indicates the probe board connector designations.

Other probe details include:
• Size: 5 cm x 10 cm x 0.02-0.05 mm (1.968 in x 3.937 in x 7.9E-4 to 1.96E-3 in)
• Mass: 0.5 g (0.0176 oz)
• Probe temperature-handling capability: > 177o C (350o F).
• Probe channels: 4.
• Analog output: 0-5 V
• Cutoff frequency <50 Hz


Interface Requirements
The probe subsystem interfaces with 3 other systems: the flight computer, the power
supply, and the payload architecture. The probes connect to the probe PCB by SMA
connectors and 40 cm (15 in) long cables. Refer to Figure 3.3.4.6 for probe placement at the
antenna nulls. Figure 3.3.5.1 indicates the probe PCB connector designations.

 

 

 

 

A diagram of the probe connector designations and placements

 

 

For more information go to SRP4 Comprehensive Design Manual page 111